Electronics Forum | Sun May 28 23:01:31 EDT 2006 | jacksaria
Hello to all, We are encountered many problems/defects in SMT lines.I would like to know your suggestion or recommendation for SMT optimization and improvement. What are the step by step solutions in order to optimized and to improve the printer, pi
Electronics Forum | Wed Jun 11 11:50:50 EDT 2008 | mmjm_1099
Mydata is a large footprint. I would personally look into AIM, XP242, or even universals or panasonics. I would make sure to watch auctions or check used market. We just purchased a XP242 not long ago from auction for about half the proce of a new on
Electronics Forum | Fri Mar 24 15:20:27 EST 2000 | Chris McDonald
I have recently purchased a Tape and reel machine from V-Tech. We are using Presure Sensitive tape and we are not geting good results. Anything bigger that a SOIC14/16 gives us trouble. The cover tape will pull off on the feeder and we will lose part
Electronics Forum | Tue Mar 04 16:02:53 EST 2003 | Dave C.
We have auto-correct funtion on our Panasonic Create CM-301 placement machines but have never turned it on because of a perceived loss of placement time when the camera verifies placement. We look at the first article and correct placemnt if needed.
Electronics Forum | Wed Aug 13 17:39:27 EDT 2008 | awegener
In light of this new information I've received from everybody's comments, I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? What kind might you r
Electronics Forum | Wed Aug 06 11:16:20 EDT 2014 | clayton
While I have had very limited experience with mancorp, the experience I have had, has been less than satisfactory. However I do have a great deal of experience with Essemtec. I currently own two complete turnkey smt lines from Essemtec and couldn't
Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
Electronics Forum | Thu May 10 15:11:53 EDT 2001 | jdtpfacreate
Paul, My company offers an excellent solution for low volume/high mix applications. The issue always becomes how can you reduce downtime/changeover. There are few features on our machines that allow you to do this effectively: -Load feeder
Electronics Forum | Mon Aug 18 15:03:38 EDT 2008 | awegener
I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? Are custom nozzles sometimes used for custom parts or are the nozzles mostly standardized? What kind
