Electronics Forum | Wed Dec 17 13:25:38 EST 2008 | evtimov
I am printing on DEKs and using simulara paramateres as for a solder it works really fine. In general going faster gives you more paste/glue. Less pressure gives you more paste/glue again. All the rest depends on your current board. Regards, Emil
Electronics Forum | Wed Dec 17 13:34:15 EST 2008 | jorge_quijano
Ok, thanks for the info, fortunatelly we already have our Camalot glue dispenser machine In-line with our MPM, for helping whit the high stand-off components.
Electronics Forum | Fri Sep 22 12:11:31 EDT 2023 | wippsen
Hi there, if there is insufficient Volume you may optimize the design of your stencil. Its not the goal to decrease the tolerances. Take the PCB and take a look at the printing Shapes with microscope or use the zoom in 3D Function. If there is too l
Electronics Forum | Mon Jan 20 13:51:12 EST 2003 | slthomas
I seem to recall seeing some references to controlling the time above 205�C as a critical parameter, although I can't find it in the archives anywhere other than one reference to a maximum of 45 seconds. What's ideal (typically....I realize differen
Electronics Forum | Tue Jan 21 11:03:15 EST 2003 | MA/NY DDave
Hi You already received good answers. A thing to remember is the components and the PCB. How high you go above 63/37's 183C should be limited to create a good solder joint. Too long creates problems since the components and the PCB start to be he
Electronics Forum | Tue Mar 04 11:28:46 EST 2008 | clampron
Good Morning, I have an application that we are tooling up for that has several LGA (Land Grid Array) components. The Gerber files from the customer has a solder paste definition of 1:1 to the pad. As I look at this part, I cannot believe that this
Electronics Forum | Wed Dec 17 09:55:10 EST 2008 | jorge_quijano
Hi to everyone, I will be runnig product with adhesive with a MPM UP2K, I'll use a 0.020" stepped stencil & metal blades. Is it better to use high speed for print head travel? more/less squeegee force than with solder? slow snap off? what could you r
Electronics Forum | Tue Jan 21 11:11:07 EST 2003 | slthomas
OK, so the issue is with the variability of the alloys on the soldering surfaces and the subsequent variability of reflow temps. Sounds reasonable (actually obvious, now that I think about it), especially on the component side. We only use HASL fin
Electronics Forum | Mon Jan 20 17:42:45 EST 2003 | jonfox
Double check the data sheets for your paste. Just as an example, ou Indium paste has a recommendation for the Heating, Liquidus, and Cooling stagees of reflow. They recommend a linear ramp up of 0.5 to 1.0 degree C. In the Liquidus stage, a peak t
Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef
Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A
