Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Mon Nov 15 12:13:41 EST 1999 | Dave F
Steve: There are guidelines for determining if your aperture has the correct proportions to the foil thickness. Maybe that�s what you�re looking for: 1 Aspect ratio = aperture width/foil thickness Chemically etched SB GT 1.5 Laser cut SB GT 1.2
Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F
Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�
Electronics Forum | Thu May 24 09:11:12 EDT 2001 | Grant Petty
Hi, I would agree. We purchased a TP9 just the slow machine, but we were a small company at the time, and it worked fantastic. Almost no maintenance, and it's a dream to changeover. The serivce in Australia is also very good, but that does not appl
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Tue Aug 22 03:04:07 EDT 2006 | PP
Any help/suggestion is much appreciated I am doing lots of BGA Reworks from a small uBGA with a few balls to a large BGA with over 1500 balls. The reworks have been done on SRT 1100 Series Machine for many years. SRT 1100 Machine is good for the c
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Mon Jul 15 09:41:11 EDT 2002 | soupatech
I am experimenting with 2 types, FG256 17x17mm and FG456 23x23mm both with a 1mm pitch and .5mm ball. They both have a full array. As for as the x-ray, we are looking into pruchasing some used equipment but will mostly send them out for testing until
