Electronics Forum | Wed Jul 18 02:09:50 EDT 2001 | winnifred
Steven, You CANNOT just use water to clean away the solder ball when u hv used RMA paste.
Electronics Forum | Thu Jul 05 09:27:05 EDT 2001 | blnorman
Our solder ball problem is linked to moisture. If the paste sits on the board too long (especially during our humid summer months) we experience the problem. As far as the problem being specific to components or areas of the board, maybe some of th
Electronics Forum | Thu May 06 10:05:58 EDT 2004 | leon
iam having trouble with solder balls around 1206 caps and resistors, have used different pastes changed oven profiles can any advise something else
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Jul 12 10:32:59 EDT 2001 | Hussman
Wow, what a string of answers and nobody brought up the easiest way to eliminate solder balls. Yes, the paste being squished under the part does reflow and work it's way out to the side during reflow. I did a 5 week study on this (when I was a bori
Electronics Forum | Mon Dec 11 15:50:01 EST 2000 | externet
Hi ! Try fresh DRY solder paste... Keep solder paste in a sealed container until the moment of use. Humidity absorbed by the soldering paste becomes vapor violently at the moment of heating it , expelling the solder in form of balls everywhere.
Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Tue Dec 12 03:15:13 EST 2000 | Chris May
The profile that you should be using, hopefully, is detailed in the paste data sheet. Connect your thermocouples to various parts of the board, depending on layout, population etc; and then run some trials observing the profile on your oven monitor/
Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME
Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha
Electronics Forum | Wed May 12 07:53:28 EDT 2004 | solderpro
Lets make it easy on the poor guy, some are correct, check you profile but remember one thing most do not apply, it is important to match the type of paste you are using with the style of oven and configuration. send a direct email and I will give so
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