Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Sat Aug 30 12:36:05 EDT 2008 | omid_juve
we are doing many experiment on this problem 1)sn63 pb37 solder paste +normal profile 2)sn62 pb36 ag2 solder paste +normal profile 3)pb free solder paste + pb free profile 4)sn63 pb37 solder paste + pb free profile but still the problem exist so i th
Electronics Forum | Thu Sep 16 17:22:16 EDT 1999 | DaveJ
We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a recomm
Electronics Forum | Tue Apr 13 08:08:33 EDT 1999 | Rob Palson
We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to bu
Electronics Forum | Mon Apr 19 02:38:41 EDT 1999 | Brian Sloth Bentzen
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Mon Jan 11 18:54:35 EST 1999 | Dean
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | I have seen this be
Electronics Forum | Tue Jan 20 06:38:06 EST 1998 | Igmar
Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this com
Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto
Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v
Electronics Forum | Mon May 19 09:29:59 EDT 2003 | bradlanger
Dave, We are using Kester Easy Profile 256 No clean Sn62Pb36Ag02. The oven itself is a Dima SMRO-0252 which is a short oven, it has 13" of preheat, 13.5" of soak, 6.25" of reflow, and 10" of cooling on the way out of the oven. We are soldering multi
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
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