Electronics Forum | Sat Nov 03 09:29:17 EDT 2007 | davef
IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree
Electronics Forum | Fri Dec 06 15:38:07 EST 2019 | davef
Not going be accused of rushing into things, eh? Tons of stuff on the web. For instance: https://www.pca.state.mn.us/sites/default/files/dfe-leadfreesolder.pdf To me, the BIGGEST issue is process and material qualification that conforms to ISO9000,
Electronics Forum | Fri Jan 31 00:21:28 EST 2020 | jineshjpr
Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2002 Micro BGA 8Ball Package.
Electronics Forum | Fri Feb 09 14:49:04 EST 2024 | erikfriesen
Its looking like this was a CPU speed issue. The BIOS defaults to X3, and it needs X7.5 for the PCA-6180E CPU card.
Electronics Forum | Wed Aug 16 18:03:10 EDT 2000 | John Thorup
Hello CK Do I understand you correctly that you are reflow soldering a copper case containing a previously assembled PCA? Insulation would seem to pose a few problems that would need to be passed on by the design engineer. 1. Keeping the heat of refl
Electronics Forum | Tue Jul 03 11:56:13 EDT 2001 | Russ Roberts
I am a Manufacturing Engineer working on a new bid. Please help with my question about a new process that I am unfamiliar with: The Assy that we are quoting involves a SMT PCA that is soldered to an aluminum chassis. All surfaces of the chassis that
Electronics Forum | Wed Nov 10 01:58:11 EST 1999 | Adel Zaky.
Mr. John A coleague of mine insisted to ask you about using a normal general purpose plastic baskets for handling the PCA's. He sujests to cover the interior of the baskets using some kind of ESD safe material(like those special ESD safe bags) to av
Electronics Forum | Wed Nov 25 21:23:29 EST 1998 | Dave F
| I like to know under what conditions the reflow profile of a solder paste is taken? Bare board, board with the solder paste, or board with high melt solder paste? | John: None of the above. The two key variables that determine the reflow tempera
Electronics Forum | Tue Aug 29 07:10:14 EDT 2000 | Vinesh Gandhi
Hi All, As fas as I have read about AOI systems they all talk of being used at POst paste printing, Pre reflow or post reflow stages. Is there any AOI equipment available/being used which can do the soldering inspection of a complete PCA for SMT as
Electronics Forum | Wed Jul 12 16:33:39 EDT 2000 | Mark Charlton
We just went through a difficult time processing SMT immersion white tins PCA's and found the following: 1. FAB vendor had a degraded tin solution resulting in improper plating thickness 2. FAB vendor was not using the proper cleaning process Get
