Electronics Forum | Fri Sep 24 13:38:16 EDT 2004 | Nick Prince
The re-use of any component has commercial implications as weel. If you check the data sheet for the component in question you will find the reflow profile, usually there will be a "Max No of Reflows". I have never seen this number higher than 2. If
Electronics Forum | Wed Feb 06 20:08:24 EST 2002 | dason_c
Francois/Sleech, thank you very much for your information, by the way where I can get the copy of the paper, what is LTVP stand for and what is the drying requirement expected ie less than 5%? I am also trying to run my evaluation to dry the parts a
Electronics Forum | Tue Apr 23 16:46:14 EDT 2002 | retronix
I would sugest the lowere the baking temperature the better, the main cause of popcorning is the water expansion and this is greatest as the water boils, 100 degrees, better to elongate the time. Matt
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette
Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w
Electronics Forum | Wed Feb 06 19:28:43 EST 2002 | sleech
I agree with Francois. We have just announced a 55 deg. C LTVP drying process that can greatly speed moisture removal. It is also effective for drying components that remain in tape and reel, conductive plastic shipping tubes or trays. Process time
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Tue Apr 23 18:34:45 EDT 2002 | mkallen
My first posting was not very clear -- sorry. Let me try again. What I want to know is: can I eliminate the drying (baking) process completely IF I know that the good parts (i.e., those not being reworked) are going to stay under some threshold tem
Electronics Forum | Tue Apr 23 14:39:49 EDT 2002 | mkallen
Here's a related question: How hot can a PBGA get before popcorn delamination becomes a concern? 100 C? 150C? I realize that the answer will depend upon the conditioning of the part, so let's assume that the part is saturated with moisture. A pra
