Electronics Forum | Mon Oct 06 12:37:18 EDT 2003 | ramanandkini
It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediately 1 hour @ -40 deg.c. The second test I did was a high humudity test for a week. After each test, I carried out a peel test with scotch tape. Those bo
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Thu Aug 31 16:18:30 EDT 2006 | GS
I beg you pardon AR, I made a mistake by reading your request, you are looking for a service lab who can do the peel back force test and not the Reference Standard (like EIA-481) for T&R. You should check if in your Country some Tape and Reeling Serv
Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef
There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea
Electronics Forum | Thu Mar 22 05:32:07 EDT 2018 | rob
Also, get your PCB suppliers to send you BBT failures that they would usually throw in the bin. In addition to print testing you and use them for profiling. We use a sticky film for print testing, then wipe, peel off and throw in the bin.
Electronics Forum | Fri Nov 09 08:18:25 EST 2007 | mulder0990
In regards to the Torque tester from Fuji that tests the peel back force, you can buy that directly from Fuji for $250.
Electronics Forum | Fri Jan 15 11:26:24 EST 1999 | Chrys
Hello, We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. So far, the tests I can think of performing, and that we have the capabi
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Tue Aug 01 16:18:59 EDT 2017 | dleeper
A quick and dirty test; Take a few inches of carrier tape, peel off the cover, gently turn it upside down and see if any of the parts stay in the tape. If they do, then you know there's an issue with the tape.
Electronics Forum | Wed Mar 29 09:31:28 EST 2000 | Erick
Marc: My experience found reliability IS a function of operator skill and attension to the process. Expecially for some RF assemblies. I worked with an engineer from Rogers to develope a process for reworking Pads for a special material. (I thing
