Electronics Forum | Mon Jul 07 23:17:34 EDT 2003 | MA/NY DDave
Hi After reading the dialog I think you should send this to a lab that can do cross sections a little etching and raise the magnification. YiEngr, MA/NY DDave
Electronics Forum | Thu Jul 10 10:34:15 EDT 2003 | davef
Don't forget that you owe me a garnet pyroxenite, if you go over there to fix this problem.
Electronics Forum | Thu Jul 10 11:49:26 EDT 2003 | davef
Dang!!!! ;P Hey, wait a minute!!! The BIG DOGS believe "it's a service, not a problem". Are you saying that they think that you're fortunate to get parts falling off of the boards? So there cracks are part of the value added? Whee!!
Electronics Forum | Wed Jul 16 14:35:17 EDT 2003 | slthomas
Well, technically speaking I was simply stating my opinion, but in retrospect (and after reading your response) I'm glad it had the affect it did. I needed the laugh. ;)
Electronics Forum | Thu Jul 17 11:55:33 EDT 2003 | slthomas
Word. WARN + NAFTA = (outplacement assistance + extended unemployment benefits) * Federal retraining $$ = outta here It's been fun. It's been a tremendous learning experience. It's even been lucrative, to some degree. But, it's also been tapped ou
Electronics Forum | Thu Apr 09 06:28:11 EDT 2009 | qualityguy
We have different Solder mask 'gloss' and 'satin' the gloss has a surface energy =40 dynes. The test evidence to date is strong correlation between surface energy, mask type, HASS failure
Electronics Forum | Thu Apr 09 18:55:49 EDT 2009 | gregoryyork
seen it many times before when the resist is not cured at manufacturing. get PCB man to check with K type thermal couple that boards ARE in fact cured. this is normally 155C ON board temperture not oven setting Cheers Greg
Electronics Forum | Thu Apr 09 21:21:11 EDT 2009 | qualityguy
Hello, another SME is saying the solder resist cure level is suspect. I have had a industry SME make reference to this too. Adjusting the cure of the resist changes the surface energy
Electronics Forum | Thu Apr 09 06:22:27 EDT 2009 | qualityguy
We aware of the extend time for cure, and in the CA activity we tried plasma etch and expose the sample to the current process, a screen test of 4 cycles -50C to 125C and the CC held in place. Std IPC tape test passed in current process and modifie
Electronics Forum | Thu Apr 09 21:15:43 EDT 2009 | qualityguy
Interesting, A north American Solder resist firm stated the same thing to a degree. They said altering the resist cure profile can effectively change the surface energy thus making the surface more conducive to conformal coat adhesion. At in coming
