Electronics Forum | Tue Nov 29 22:16:43 EST 2005 | ams_gen
Hello, Could any body direct me to guidelines describing the best practices for rework of perimeter array components (such at SOIC's and QFP's) or may be share your opinion of the best approach to do this? Thanx, AMS
Electronics Forum | Wed Nov 30 08:00:59 EST 2005 | davef
Look here: http://www.circuittechctr.com/guides/guides.shtml Also consider IPC-7711/7721: Rework and Repair Guide
Electronics Forum | Wed May 28 08:25:08 EDT 2003 | davef
That's what we do [no more than three reworks or mods]. Your "four reworks permissable" was probably based on the 55110 five thermal cycles, counting wave soldering as the first cycle. How do you plan to keep track of each of those rework actions?
Electronics Forum | Wed Nov 30 09:12:18 EST 2005 | ams_gen
Thanx Davef!!! This is a good link. I appreciate this. Ams
Electronics Forum | Tue Dec 06 06:11:16 EST 2005 | bwet
A good soldering tip video on an SOIC is at http://www.solder.net/technical/tips.asp BWET
Electronics Forum | Fri Dec 21 13:51:16 EST 2007 | howard stevens
Gentlemen, This is an interesting topic. If one refers to the Nihon Superior patent, they make the following claims. "Germanium makes the crystal finer when the alloy solidifies. Germanium appears on a grain boundary, preventing the crystal from b
Electronics Forum | Mon Mar 20 19:27:14 EST 2000 | Marc Ruggiero
Hello, I am looking for inputs (experiential or opinions) concerning field reliability of high-frequency RF boards that have had a trace or pad repair (or both), any package type. If anyone can comment on this subject, I would appreciate it. We bu
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p