Electronics Forum | Mon Jul 18 14:37:33 EDT 2011 | ldavis
We use the same profiler for convection and VP. For VP you just have to be very careful as the thermocouple wires must travel through the machine so cannot get "snagged" on anything as they go in or come out.
Electronics Forum | Wed Jul 20 11:44:35 EDT 2011 | pbarton
We do the same as LarryD. All the profilers I have seen that have thermal jackets deemed capable of going through and helping the logger survive the VP process have a lot of mass. This mass will affect the profile considerably.
Electronics Forum | Wed Jul 10 14:29:27 EDT 2013 | isd_jwendell
You wouldn't have a very good profile if you went straight from room temp to vapor temp (_-). The chamber should preheat the board before using vapor to melt the solder.
Electronics Forum | Wed Jul 17 11:26:19 EDT 2013 | pbarton
What equipment do you have? As well as the comments from others, another major influencing factor can be the residual heat in your PCB carrier. It takes more heat energy to warm a cold carrier than if it is already hot from the last cycle run. This
Electronics Forum | Mon Jan 19 05:02:07 EST 2015 | gertjannus
I've some troubles with LGAs components. i try to create void free results. so far i have no problems with dpacks, i think i do something wrong with the vacuum time. The padcoverage of my lga is very bad the vacuum creates solderballs under the compo
Electronics Forum | Wed Jan 30 06:08:09 EST 2002 | nifhail
Can someone pls help to explain what is the vapour phase reflow soldering technology ? Thx, nifhail
Electronics Forum | Wed Jan 30 12:37:49 EST 2002 | jax
nifhail, In a nutshell: Vapor-phase reflow is a process that uses a fluid with a selected boiling point. As condensation of the hot vapor occurs on a cool assembly the assembly's temperature is rapidly raised to match the temperature of the vapor.
Electronics Forum | Tue Aug 17 03:03:56 EDT 2004 | soease
thank you Grant and dreamsniper for these shared experiences; I think I'll still try some vapor phase just to have a look to this process, but will focus on a convection as long as it's the actually chosen technology in the company and that it's expe
Electronics Forum | Wed Aug 19 16:07:58 EDT 2009 | davef
We don't know dip about vapor phase soldering, but we can't help but wonder how well the leads of the component match with the pads on the board.
Electronics Forum | Thu Aug 20 19:07:29 EDT 2009 | smt_guy
reduce the stencil aperture to prevent tombstoning in vapor phase process. from my experience a 6 mil thick must be at least between 20 to 30 % aperture reduction for 0805's and below. cheers!
