Electronics Forum | Tue Jul 20 08:37:42 EDT 1999 | Dave F
| First of all, I'm a young Spanish so sorry for my English | | I'm looking for a smd single pin connector. I need it to solder it in a alumina's substrate. | | Please. can anybody help me ? | Baddia: That everyone with English as their first la
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Thu Sep 17 03:32:31 EDT 1998 | Thomas Blesinger
can anyone help with information about I-shape of SMDs. our Design includes this shape of contacts. we are searching for information on quality judgement of solder joints with I-leads on Pads. Please help.
Electronics Forum | Wed Sep 15 04:12:11 EDT 2010 | headlad
We had a similar problem so we shrunk the thermal and extended the pads. This allowed us to ensure solder resist was applied to the track in between. It fixed our problem.
Electronics Forum | Thu Sep 16 08:47:39 EDT 2010 | headlad
I extended the pads to help ensure the component locates correctly and to allow for easier re-work should problems occur. I reduced the thermal by 5% but you may want to speak to your fabricator and ask what they require to ensure that the resist is
Electronics Forum | Thu Jul 05 16:32:54 EDT 2012 | jorge_quijano
I have never use it, but I know autosplice has machines that can break them automatically, I don know how they work but I know that some people in my area use these machines for the same process as you. Hope it helps.
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Tue Jul 27 16:08:04 EDT 1999 | Kathleen at ATL
I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the perime
Electronics Forum | Mon Aug 09 10:27:14 EDT 1999 | Tim Murphy
Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, and/
Electronics Forum | Wed Sep 15 10:59:12 EDT 2010 | asksmt
Thanks for the valueable feedback, I have two questions 1. why do you have to extend the pad size ? is it okay if i keep pad size 2. I am currently using thermal pad size recommended in datasheet max value 4.2mm x 4.2mm, how much should i shrink
