Electronics Forum | Wed Jan 15 11:53:40 EST 2020 | avillaro2020
As far as the large thermal gradient I have on my thick and thermal heavy board, I've done quite a bit to minimize the gradient but not successful. it's like one pad is connected to a signal while the other pad is connected to ground, you can't bring
Electronics Forum | Fri Aug 21 17:34:53 EDT 2009 | rajz
Need a help from friend, I got a issue that we face a defect that solder on nexlev pin after reflow owen.
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Thu May 06 13:06:36 EDT 2010 | dwonch
Unfortunately nothing ground breaking to report. The board shops analysis (SEM/EDS)showed high levels of carbon and oxygen, likely indicating an organic based contaminate. They are still stumped on where it is coming from. We recieved some boards y
Electronics Forum | Fri May 21 12:24:21 EDT 1999 | KA Stillings
I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!!!
Electronics Forum | Wed May 10 13:03:50 EDT 2006 | PWH
It sounds like your depaneling method is good. The only thing left to look at is to see if the depaneler is hitting the part somehow from the cutter or the bottom plates. I've seen time and time again where an operator has a part in contact with th
Electronics Forum | Fri May 21 15:20:26 EDT 1999 | JohnW
| I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!
Electronics Forum | Tue Mar 23 23:17:03 EST 1999 | Chris G.
| Are there many of you who are soldering through hole parts in your surface mount reflow oven? How repeatable is the process? Do you need to touch up a lot after reflow? We don't do long runs maybe 200, 300 boards max. Can you just screen print
Electronics Forum | Mon Feb 12 11:13:12 EST 2007 | davef
Q1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? A1. It depends on your current oven. Some ovens can meet the higher t
Electronics Forum | Sun Jul 26 07:52:35 EDT 2020 | sync40
Hello to everyone, Have you ever experienced soldermask bubbles inmediately after printed the soldermask itself? (for screen printing method of LPISM). I am not talking here about blistering or any outgassing defects after exposing to high temperatu
