Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG
We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
Electronics Forum | Mon Jun 26 12:23:11 EDT 2006 | Rob
Yep, Book a holiday and let someone else sort it out. Otherwise e-mail me and I'll talk you through pallets, rigidisers, printer tooling, spray mount, Kapton tape, local fiducials (panels can strech & shrink) etc. Oh, yeah - for the connectors you
Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet
Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET
Electronics Forum | Tue Jun 19 21:44:20 EDT 2007 | rfrog
The first thing that I would do is contact the smock manufacturer and ask them for advice on testing the smocks. ESD FROM A TO Z 2nd ed. (Kolyer) states that: smocks should have a resistivity of less than 10^12/sq and must not shed steel fibers.
Electronics Forum | Mon Oct 02 11:16:44 EDT 2000 | aflewelling
A new book on "hermeticity" by Hal Greenhouse has been offered by William Andrew/Noyes Publishing to us for review. This subject deals with sealing integrity in electronic packaging. Is this a book you would be interested in reading and reviewing f
Electronics Forum | Thu May 22 15:13:34 EDT 2008 | realchunks
I'm not b*tchy. You "guys" are too sensitive. I took my HR training and now know how fragile you "guys" all are. It's not your fault, it was my fault and I learned to deal with it. Go pop some popcorn.
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
Electronics Forum | Fri Aug 19 05:07:00 EDT 2011 | robertwillis
Its not a problem to do you just modify the procedure slightly for the smaller thinner parts. There some images and on my CD ROM and posters see http://www.packageonpackage.co.uk website I will also be doing a workshop at APEX and there is a webinar
