Electronics Forum | Thu Mar 29 15:50:35 EST 2001 | tomgervascio
We've think that with seen solder shorts under BGAs after wave soldering the boards. In addition, it seems to be related to a certain soldermask configuration over the topside BGA vias.. THere is one vendor,A, that is applying soldermask after HASL,
Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob
Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis
Electronics Forum | Wed Jan 08 10:54:19 EST 2003 | dphilbrick
As Russ says this should process well the BIG BUT..T is what are you using to process this part! How old / capable is your equipment. Screen print quality is a must. Placement accuracy is critical and reflow stability is important. So the answer is d
Electronics Forum | Tue Jan 07 15:14:25 EST 2003 | russ
What exactly are you concerned about? This is from what I can see a pretty standard part (30 mil pitch, 17mil ball). Sorry, I have to convert to inches for my weak brain to work! This part should process very well. Russ
Electronics Forum | Tue Jan 07 15:03:25 EST 2003 | ksfacinelli
I have a client interested in using a Toshiba Part P-TFBGA48-0607-0-0.75AZ. Mechanical data on the part can be found at: http://www.toshiba.com/taec/components/Datasheet/51WHM516AXBN.pdf I am concerned with being able to use this part with consist
Electronics Forum | Thu Jan 09 06:35:14 EST 2003 | mk
Consider ssd. Eliminate paste application. No printing necessary. www.sipad.net mk
Electronics Forum | Thu Jan 16 09:44:55 EST 2003 | Evtimov
hi, I have experience in placing BGA's with this pitch and it's OK.Tell me more about your problem(printing ,placing, accuracy rotation) or whatever ti is.
Electronics Forum | Thu Oct 27 06:36:33 EDT 2022 | richardcargill
The PCB needs to have a flat finish to the pads too - HASL finished boards don't work well with fine pitched ICs/QFNs etc
Electronics Forum | Thu Oct 27 20:46:35 EDT 2022 | emeto
Also solder paste type, optimized printer parameters suitable for this paste, correct apertures design on the stencil, stencil thickness, proper AAR, mounting accuracy and placement profile, oven profile, board thickness and a few other.