Electronics Forum | Mon Jul 14 11:35:09 EDT 2008 | stepheniii
NASA won't allow a pure tin finish in space. Any part with a pure tin finish must be recoated.
Electronics Forum | Fri Aug 08 08:00:46 EDT 2003 | davef
Matt: You're correct. Do not mess with these boards. If the immersion tin [imm tin] is discolored, it will not solder with routine processes. Ask your customer to return the boards to his / her fabricator and have the imm tin replated. The fabri
Electronics Forum | Thu Aug 14 14:01:03 EDT 2003 | Andrea
I was recently given a copy of the "Tin Whisker Agency Action Notice" I was then asked to recommend and implement a action to prevent the suseptible components from reaching our stockroom. Since I can not commit my personel to activly research which
Electronics Forum | Fri Jun 03 16:40:48 EDT 2005 | Andrea
I have a customer who has put a restriction against pure tin finish components. We have gotten our BOMs compliant with all but 5 parts. Fairchild p/n FDD6512A, FQD12N20C, IRLM120A Bournes 3214G-1-501E Sprague 10TS-D10 I am looking for a standard pr
Electronics Forum | Sat Jun 04 21:02:48 EDT 2005 | adlsmt
Sorry Dave, I meant lead free finishes.
Electronics Forum | Sun Jun 05 08:45:44 EDT 2005 | davef
There is none. That's why aerospace is exempt.
Electronics Forum | Mon Jul 14 07:49:50 EDT 2008 | edmaya33
Do we really need to follow the IPC J-STD-001 Solder purity? If so, how to effectively balance the chemistry of Sn63/Pb37 other than adding a pure tin on the solder bath? Is this really needed to monitor in monthly basis?How many kgs of pure tin pe
Electronics Forum | Thu Oct 31 17:34:37 EDT 2013 | hegemon
Keep in mind that you may need to assure that there are no pure tin finishes remaining on your parts. A general idea is that parts with pure tin (RoHs) finish will need to be plated with tin-lead solder to avoid the possibility of tin whiskers formi
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
