Electronics Forum: qfp and lead and straightener (Page 2 of 2)

J-STD-002 and -003 solderability testing...

Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef

Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork

I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi

In same board both leaded and lead-free components used.

Electronics Forum | Tue Jul 13 07:22:43 EDT 2004 | Kris

Hi Imtiaz, Can you give a brakup of the 23 components and their end mettalurgy ? Chip ?? QFP/TSOP ?? BGA ?? Aluminium Caps ?? this will determine whether you can do it or not

Any different between Flat Ribbon and Gull Wing Component?

Electronics Forum | Thu Apr 12 01:11:12 EDT 2007 | Haris

Gull wing components are name on the pin/lead shape of the ICs like sop, qfp, pqf etc while plcc IC package is named on J-lead componets. Flat ribbon is of cable/wiring type and it is not a component,see this website. http://directory.jimtrade.com/2

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo

A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w

Crystalization on TI QFP and other fine pitch components

Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1

We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence

The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3

Line release of post reflow AOI and AXI

Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon

You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice

Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl

Previous 1 2  

qfp and lead and straightener searches for Companies, Equipment, Machines, Suppliers & Information

Solder Paste Dispensing

Training online, at your facility, or at one of our worldwide training centers"
Selective soldering solutions with Jade soldering machine

High Throughput Reflow Oven
SMT feeders

High Resolution Fast Speed Industrial Cameras.
SMT spare parts

500+ original new CF081CR CN081CR FEEDER in stock