Electronics Forum | Mon Jan 17 14:03:45 EST 2005 | davef
There's a fair amount of information on underfilling CSP and flip chip in the web. Look here to get started: * http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID
Electronics Forum | Thu May 01 13:58:31 EDT 2008 | mmjm_1099
In our house we have had some of our BGA's reballed because it was a lead-free part and wanted to place on a leaded assembly. Hope this helps.
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Mon Aug 10 15:15:17 EDT 2009 | indity
I have very little knowledge of pick and place machines or assembly, and was hoping someone could give me some advice of where to start looking. I do learn quickly so I am not afraid of challenges or learning through mistakes. I need to produce abou
