Electronics Forum | Tue Aug 11 19:46:34 EDT 2009 | padawanlinuxero
Guys I have a question since the ever present problem with the crack switch we had to change to a low temp lead free solder paste in these case eutectic 58Bi/42Sn and 57Bi/42Sn/1Ag alloys, now the main question whats diferent between these one and th
Electronics Forum | Wed Sep 28 03:58:05 EDT 2011 | Jacki
Hi All My company is doing PCB assembly.To save cost, we change our wave solder bath from SnAg to SAC 305. What is the pros and cons for using SAC 305 solder? And,will affect to our quailty? Thanks in advance.
Electronics Forum | Fri Oct 01 01:25:55 EDT 2021 | sn
Thank you Djo for your sharing. By the way, do you know that which field/product will prefer to use SAC405 paste instead of SAC305 or lower Ag wt% alloy solder paste?
Electronics Forum | Fri Jul 08 09:14:49 EDT 2005 | Jason Fullerton
I've tested boards with SN100C HAL finish, and wetting to the PCB finish was poor at best, using a no clean SAC305 paste.
Electronics Forum | Wed Jul 27 09:47:01 EDT 2005 | GCampbell
CEMCO Uk have done testing using SACX0307, SAC305 and Sn/Cu/Ni. The copper dissolution tests (report available) conducted at CEMCO showed that the lowest copper erosion rate was achieved by SACX0307. Regards Gerry
Electronics Forum | Wed Jul 27 17:18:07 EDT 2005 | Carl
Any issues in your experience using SAC305 for reflow and SN100C for wave on ENIG pcbs? I've seen the CD, but there's not much specific data regarding ENIG pcbs Thanks
Electronics Forum | Tue Oct 05 12:46:02 EDT 2021 | emeto
From what I understand SAC305 and SAC405 are considered low silver content and have the better overall mechanical qualities compared to more silver or no silver.
Electronics Forum | Fri Oct 01 01:27:58 EDT 2021 | sn
Hi Davef, thank you for your information.
Electronics Forum | Fri Oct 01 03:16:39 EDT 2021 | sn
thank you for your information.
Electronics Forum | Thu Jun 28 15:38:37 EDT 2012 | davef
Matthew: That you can get solder flow when hand soldering, but not when reflow soldering, seems to be telling you that you're not getting the connection warm enough during reflow. You need to have those connections liquidous + 20*C for at least 5 sec
