Electronics Forum: screen printing via test point (Page 2 of 6)

Water Soluble vs. No Clean

Electronics Forum | Tue May 02 15:43:06 EDT 2006 | bhall

Thank you PWH, All good points. I use a semi-automatic printing process not a screen printer so if more solder balls and beads are created then I would be creating more re-work and that is exactly what I do not want to do. I guess the best thing to

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F

| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints

SMT Line Test

Electronics Forum | Mon Jan 21 15:55:53 EST 2002 | Yannick

The point behind traces and vias on my test is that I don't only want to perform test on printing and placement but on reflow too, so a board with many components and no trace will not react like a board with traces on it. Unless you or someone else

Re: BGA open pin

Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean

Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po

Re: I wonder

Electronics Forum | Fri Sep 10 11:45:09 EDT 1999 | Scott S. Snider

| scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X's | for defect. To know major X's with DOE we need a good measurement equipment.

RMA vs No clean

Electronics Forum | Thu Jan 16 05:42:18 EST 2003 | nifhail

I've a query. I have one new Customer whom insisted us to use RMA paste on their product. The problem is, on some of their products they use via hole as the test point in where all the PCB finished are ENTEK and as usual I have to print solder paste

Help with PCB design

Electronics Forum | Wed Jan 30 15:46:32 EST 2013 | davef

First, look here [http://www.ti.com/lit/ug/snva500/snva500.pdf ] This is the actual pdf from TI, not some cheap-ass reproduction, like the link you gave us. Orange polygons [and other shapes] - copper covered with ENIG * On the edge of the board, bo

DEK pro-flow

Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)

Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators

Tenting via(s) under BGA & CSP?

Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef

First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate


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