Electronics Forum | Fri Oct 15 08:01:12 EDT 2010 | patrickbruneel
What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick
Electronics Forum | Fri Oct 22 19:07:29 EDT 2010 | jry74
To get out of a delivery pinch, I had to pre-tim some connectors because of contaminated leads. Make sure your selective wave speed and XYZ travel are close. Try doing a dry run across the board to preheat the PTH and then go back and solder them.
Electronics Forum | Thu Oct 28 00:59:31 EDT 2010 | emmanueldavid
Hi, An useful information (Bruneel is right) that concluded with a root cause Note. Appreciated Heguman, Bruneel & John. Many Thanks, David, India.
Electronics Forum | Fri Oct 15 11:03:50 EDT 2010 | hegemon
Well, we got the baking part right at least. I would think that would help to rule out the barrel cracks allowing moisture escape. Plating too thin makes sense to me. In any case, do you think barrel cracking would be observable on a bare PCB?
Electronics Forum | Fri Oct 15 11:32:04 EDT 2010 | patrickbruneel
Inspecting for plating problems shouldn’t be part of incoming inspection. Your board manufacturer should have the appropriate process control. I shouldn’t have said barrel cracks but plating skips. Plating skips are caused by dull drills or a too hi
Electronics Forum | Fri Oct 22 19:34:56 EDT 2010 | hegemon
Thanks for the help guys. Nice to think I was basically on the right path. PCB manufacturer has finally conceded the barrel defects and is remaking the PCBs. We are big on pre-tinning the leads of TH connectors as well as providing some good pre
Electronics Forum | Thu Oct 14 17:10:37 EDT 2010 | hegemon
Heck, now I look up and see this is SMTdotNET. Do I get banned for asking a TH question? So here's my first real TH issue after living so long in the SMT world. We are having a sudden issue in what has been a stable process for quite some time. I
Electronics Forum | Thu Feb 02 11:01:57 EST 2017 | charliedci
Maybe increased barrel fill? Raising pot temps slightly seems to increase barrel fill at selective solder, something we battle with.
Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist
Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.
Electronics Forum | Wed Oct 17 12:05:08 EDT 2018 | charliedci
We had a selective solder installation tech raise the connector body off of the PCB slightly with a spacer to allow for a visual inspection to verify the process/profile. A few years back we invested in a large enclosure X-ray with a manipulator arm