Electronics Forum | Thu Aug 21 08:33:09 EDT 2008 | davef
There is no standard as such. It's easy to see why. It's too complicated and has such a small payoff. Standoff is comprised of: * Package height * Solder thickness between the pad and the component lead * Delta of pad thickness and solder mask For p
Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey
Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die
Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef
What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board
Electronics Forum | Wed Nov 05 19:40:25 EST 2003 | Mike Konrad
Here's the official press release... New York, NY (November 5, 2003) -- KPS Special Situations Fund II announced today that it has acquired the stock and related assets of Speedline Technologies, Inc. from Cookson Group, plc for a total consideratio
Electronics Forum | Thu Jan 21 15:24:18 EST 1999 | Terry Burnette
| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h
Electronics Forum | Tue Mar 22 17:08:01 EST 2005 | finepitch
We might need to open up the term "mass production" here, but I will give it a try anyway. I've seen semiconductor packaging companies in the far east where they pick up balls with a vacuum head, consisting of holes matching the pattern of the BGA p
Electronics Forum | Mon Jun 29 06:21:08 EDT 2009 | hishamuddinjohari
Please help me to find the following transistor. Marking code AJZ 438 Package style SOT223
Electronics Forum | Wed Jun 18 13:08:52 EDT 2008 | sleech
Dave: You are spot-on right! The major hurdle is that 70 degrees C is below the boiling temperature of water. Only a near zero relative hudity chamber will cause the ingested moisture to migrate from a package. There is one facet of the 70 degree p
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Mon Dec 18 01:25:47 EST 2006 | seety1981
test engineer and product engineer... Hi all, Sorry if this topic is not suitable to be in this forum.. anyway,... i would like to know what the different of the jobs scope between the Test Process and Test Product engineer in semiconductor manufac
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