Used SMT Equipment | SPI / Solder Paste Inspection
SPI PARMI SPI HS60L PARMI solder paste inspection machine SPI HS60 product introduction: 1. The SPI HS60 Series series is PARMI's best-selling model. It has been installed in excellent SMT production sites around the world. Its performance st
Used SMT Equipment | Pick and Place/Feeders
A JUKI high-speed patch machine JX-350 prototype and JUKI long substrate high-speed patch machine JX-350 are available for sale. They are most suitable for LED lighting machines or LED patch machines for medium and large LCD backlight production.&nbs
Used SMT Equipment | AOI / Automated Optical Inspection
Koh Young In-Line 3D AOI Vintage: 2013 Model: Zenith Lite 3D Automated Optical Inspection 4m Pixel High Speed Camera 20 Micron Camera Resolution 3D Shadow Free Moire Technology Complete & Operational
Used SMT Equipment | SPI / Solder Paste Inspection
Koh Young In-Line 3D SPI Vintage: 2013 3D Solder Paste Inspection 5m Pixel Camera 3D Shadow Free Moire Technology 35 Micron Resolution Auto Conveyor Width Adjustment Complete & Operational
Used SMT Equipment | SPI / Solder Paste Inspection
SKU 16529 • Fastest solder paste inspection (SPI) system • Excellent 3D inspection • 3D SPI system for mid- to high-volume manufacturing • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 compon
Used SMT Equipment | SPI / Solder Paste Inspection
TRI TR7007 3D Solder Paste Inspection Technology, SPI, Year 2011 Test Research Inc. (TRI) Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspe
Used SMT Equipment | Soldering - Reflow
Main features, or Main advances Mistral 360 Forced air convection heat to maximum temperatures up to 572°F 300°C. Forced air convection provides uniform heating and prevents shadowing. Four heat zones, each independently controlled for accurate te
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Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI In-line Solder Paste Inspection (AOI) System • Model: 3D XPI 4000L • Vintage: 04/2008 • Voltage 220 • FAHP (Flying Absolute Height Profilometry) Measurement method • Dual Light Source and On-the-fly Image scan • High power M/H li
Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI In-line Solder Paste Inspection (AOI) System • Model: 3D SPI • Vintage: 11/2009 • Voltage: 220 • FAHP (Flying Absolute Height Profilometry) Measurement method • Dual Light Source and On-the-fly Image scan • High power M/H light 3
Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI 3D Solder Paste Inspection System Model: 4000L 3D SPI Year: 2009 Accuracy and warp compensation Unmatched true resolution, accuracy and repeatability Full-featured absolute measurement of the full board surface, mapping to
