Electronics Forum | Fri Aug 12 17:36:06 EDT 2011 | grics
Dave is correct. Also, you should check the TDS's of the caps and the display before processing to see if they can withstand the process temps, look for a recommended solder profile or info for the manufacturability of the device. On another note,
Electronics Forum | Sat Aug 13 10:56:57 EDT 2011 | jldowsey
Process Flow #4 in davef's response is your best bet for this assemblly judging buy your pictures. We purchase our selective wave solder pallets from Ascentec Engineering - they can fabricate a pallet to hold your assemblies, keep the SMT devices pro
Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch
Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to
Electronics Forum | Mon Dec 15 16:08:41 EST 2008 | dyoungquist
We have been running double sided surface mount pcb assembly for several years with no adhesive needed. We paste, place and reflow one side, then repeat the process for the other side. With Rs, Cs and small to medium ICs we have no problem with par
Electronics Forum | Tue Oct 03 13:08:39 EDT 2006 | Moby
This is an issue that we are seeing a lot! It used to be that the primary-side (component-side...top-side) had most of the active components. It was simple: reflow bottom first. Now, we are seeing both sides of the assembly having the same amount of
Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Tue Sep 04 11:26:12 EDT 2001 | Jean Michel
During the solderin of a double side board, how can I calculate the maximum weight of a component I can put in the first side to avoid the component fall down in the oven (depending on the soler join surface) ? Are there some rules ?
Electronics Forum | Mon Mar 26 02:09:35 EDT 2007 | Amy
Anyone knows about the top side remelting requirement for wave soldering process? Is there any standard & procedure to follow? What temp can cause the solder for top side to re-melt?
Electronics Forum | Tue Sep 04 16:51:51 EDT 2007 | jseagle
Does anyone use the side cameras on the YesTech or Mirtec AOI systems? If so, how are you using them? Automated side inspection or as a tool to manually evaluate calls? Thanks James
Electronics Forum | Tue Dec 09 12:26:45 EST 2008 | greene08
I have virtualy no experience with placing bottom side components. We have a new board coming that will have a few R's & C's bottom side. Can anyone give oppinion on dispensing glue dots vs. applying adheasive with a stencil ? thanks
.gif)
