Electronics Forum | Thu Jul 20 17:10:11 EDT 2000 | Darby
It's six in the morning here! Give me a bell the next time you are out here and I'll take you fishing on the sensational Sydney Harbour. However I will not be getting out of the boat and "diving" - too many noahs arks. I'll leave that to the daredevi
Electronics Forum | Thu Apr 05 22:27:06 EDT 2001 | davef
As a band-aid, consider running your chip wave when soldering these boards [Similar to Cals "dance with me babe" suggestion.] If the problem is as broad based as you say and the radial components have a tight fit, consider increasing the holes by a
Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.
Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to
Electronics Forum | Mon Dec 13 05:43:27 EST 1999 | Wolfgang Busko
Hi Steve, 20 mil pitch shouldn�t be that problem nowadays. In your case bridging and poor wetting seem to go hand in hand. For the poor wetting try to eliminate it by using different paste (higher activated) and work on your profile. Coplanarity also
Electronics Forum | Mon Dec 13 09:43:28 EST 1999 | Chris May
As Wolfang says about slightly bent legs, handling is of the essence. Are these devices decanted into another tray for your machine. It may be worthwhile doing a "movement" chart for these components. Do not explain why or when you are doing it beca
Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra
Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t
Electronics Forum | Mon Dec 13 19:34:09 EST 1999 | Steve Thomas
Thanks, gentlemen. All points well taken, and some hit pretty close to home. Our pick-and-place programmer assures me that coplanarity isn't the issue because the machine won't (or can't) place parts beyond an acceptable criteria. It's an Amistar
Electronics Forum | Wed Oct 30 16:05:08 EST 2002 | msimkin
Hi, I have received a report form a board supplier, analysing the reuslts form non wetting problems we have been expereincing with their boards. I assumed it was due to the gold layer being too thin, thus allowing the nicklel layer to be exposed and
Electronics Forum | Tue Feb 11 12:02:52 EST 2014 | javierec
Process: Batch Cleaner, @16% concentration. Concentration is checked daily. Cleaning after Wave Process. See attached pictures and comment and what you think causes the solder joint to turn grey. i have read post that say the grey dull looking sol
Electronics Forum | Wed Mar 12 09:33:55 EDT 2014 | neiderman
The grey solder joint appearance in the picture looks to be due to chemistry etching the joints. This can be a common problem with alkaline chemistries running at high concentrations and or alkaline chemistries running in batch machines that require
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