Electronics Forum: sn3.5ag (Page 2 of 3)

Re: oven ventilation requirements

Electronics Forum | Wed Aug 04 16:55:32 EDT 1999 | Doug

| We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough t

Re: oven ventilation requirements

Electronics Forum | Thu Aug 05 10:13:44 EDT 1999 | Boca

| We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough t

Component Lead Finish - Article in Japanese Can some body help ?

Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas

Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde

Re: Lead Free Solder used in BGA

Electronics Forum | Thu Jan 14 11:06:33 EST 1999 | Earl Moon

| | Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | | | K

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay

First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183

Re: oven ventilation requirements

Electronics Forum | Wed Aug 04 16:43:58 EDT 1999 | John Thorup

| We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough t

Re: oven ventilation requirements

Electronics Forum | Thu Aug 05 10:46:20 EDT 1999 | Dave F

| We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough t

Re: oven ventilation requirements

Electronics Forum | Thu Aug 05 11:27:43 EDT 1999 | Wolfgang Busko

| | We are installing a new reflow oven and I have been told that we do not need to vent the exhaust out through the roof since we have a false ceiling. All that is required is to vent above the false ceiling and that the air exchange is great enough

Re: Fillet Lifting

Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary

The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate

Re: Pb Free Products

Electronics Forum | Wed Sep 22 22:18:37 EDT 1999 | Dave F

| I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/Pb)


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