Electronics Forum | Wed Jan 07 14:33:00 EST 2015 | eezday
The assumption that a HASL Sn63 PCB can be soldered with SAC solder paste is likely a bad one. The board itself is likely FR4 which can be damaged by lead free temperatures. The HASL finish isn't an issue from the perspective of it's makeup and actu
Electronics Forum | Tue Jul 05 17:16:01 EDT 2005 | davef
We agree with Pat, but it's far from straight forward. [er maybe we should say we don't understand it.] We duplicated the results of a posting on the web. Flux, then dunk copper wire into tinning pots set at 250*C for measured periods of time. The
Electronics Forum | Thu Oct 01 16:56:40 EDT 2009 | gplume
Does anyone out there have experience soldering with Pb solder (Sn 63 or Sn 62) to SAC 305 coated PCB lands (about 50um) or Sn-Cu plated lands (about 10um). I know soldering Pb free (Sac based soler) to Pb/Sn coated lands is a no-no, but was waonderi
Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C
Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil
Electronics Forum | Sat Aug 30 12:36:05 EDT 2008 | omid_juve
we are doing many experiment on this problem 1)sn63 pb37 solder paste +normal profile 2)sn62 pb36 ag2 solder paste +normal profile 3)pb free solder paste + pb free profile 4)sn63 pb37 solder paste + pb free profile but still the problem exist so i th
Electronics Forum | Wed Jun 26 11:13:09 EDT 2002 | robbied
Can anyone help? Our Solder bar suppier is discontinuing the Sn63 Pb37 solder that they currently supply us. Another company has offered us a 'direct replacement' which is their own Sn63 Pb37 solder bar. The only problem I have with this is that the
Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim
Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha
Electronics Forum | Mon Jun 13 10:28:29 EDT 2005 | andymackie
I've had a lot of experience with solder spatter. It's usually related to moisture (humidity) uptake by the paste, or outgassing from plating: particularly Au/Ni. Solder spatter from the plating will change from board-vendor to board-vendor. I shoul
Electronics Forum | Tue Aug 09 06:21:19 EDT 2005 | bwet
Ladies and Gents: There have been several ways discussed in the trade press and in papers re: how to seperate/keep seperate Sn63 and l-f hand soldering tools. Some claim comepletel seperate hand soldering tools are required, while others claim that
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
