Electronics Forum | Mon Jun 01 17:49:39 EDT 2009 | gregoryyork
Sorry looking at your profile again and considering its Aluminium substrate I would opt for an increase to the preheat or introduce a soak to the profile to get the PCB up to reflow. Try soaking between 175 - 200C sufficient enough to heat the whole
Electronics Forum | Mon Jun 03 13:10:35 EDT 2019 | gregoryyork
We recommend a ramp soak spike profile for HASL finish, so everything gets nicely heated during reflow, we soak around 180C and peak at 245- 250C and don't have any issues as long as the levelling isn't too peaky.
Electronics Forum | Fri Dec 27 14:24:15 EST 2019 | ameenullakhan
Yes we have tried with low soak with longer reflow and high peak also low soak.. short TAL and low peak.. but were not able to eliminate the issue
Electronics Forum | Tue Sep 02 15:29:36 EDT 2008 | bvdl
small pads like 0402 tend to get hot quite easily. looks like excessive heat is your problem here. pads are wetted, component leads are not. this means solder paste flux on top layer was exhausted before entering in reflow. your profile is the 'in-be
Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
Electronics Forum | Thu Jul 01 23:56:06 EDT 2004 | rsthompson
I'm having a philisophical discussion with my boss regarding long reflow soak times to improve soldering under BGA devices. Is there anything to be gained by extending soak times at the 150C level from 60-90 seconds to 5-10 minutes? I've never seen
Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.
Electronics Forum | Mon Mar 08 21:50:16 EST 2004 | John Soileau
I expierenced this while at I-PAC Manuf. when the reflow profile was too hot in the perheat & soak zones.
Electronics Forum | Wed Nov 03 14:11:18 EST 2004 | russ
Sam, are you asking or telling us these things? russ
Electronics Forum | Wed Mar 09 08:23:31 EST 2005 | davef
We don't have experience on this, but first we'd talk to a technical type at our solder paste supplier. Baring that, we'd: * Soak a paper towel in a 'solvent' [ie Kyzen XJN, EnviroSense Enviro Gold, Petroferm Hydrex, etc]. * Place the towel in conta
