Electronics Forum | Thu Jan 03 02:26:12 EST 2002 | arzu
Hello, I need to know the volume spread of solderpaste after screenprinting fine-pitch paste using a nickelformed screen. It is the end-result that counts , so of course the spread of metalcontent in the paste is important too. Can anyone tell me som
Electronics Forum | Sun Mar 07 19:53:38 EST 2004 | praveen
Hello, Voids in BGA can not be eliminated. You can only minimize them by reducing the solder paste volume. Try to bake the plastic BGA's and PCB both as per the standard. Check the PCB at the BGA locations if the via's are masked.Masked via's result
Electronics Forum | Wed Dec 08 18:22:47 EST 2004 | msjohnston1
Here is a list of companies that have solder paste inspection equipment that use a laser for measurements www.gsilumonics.com www.orbotech.com/products_assembly_main.asp www.fa.panasonic.co.jp/products/smt/inspection/main/ipm_e.html
Electronics Forum | Thu Dec 09 16:10:41 EST 2004 | Jerry
Although its not laser based but actually white light base system. Have a look at http://www.christopherweb.com/koh1.html
Electronics Forum | Thu Dec 09 22:45:30 EST 2004 | kanwal324
We are using UBM laser scane offline. You can search for it in google. Nice machine using from thelast eight years.
Electronics Forum | Fri Jun 02 08:50:47 EDT 2006 | russ
Hmmm interesting, we utilize 5 mil stencils and print to same height as you and do not experience these failures. May I ask what paste you are using and what the spacings are of your pad design? But anyhow, if it works it works.
Electronics Forum | Sun Jun 04 21:05:56 EDT 2006 | ec
Hi Russ, I could not send any attach file using smtnet.......anyway thanks your input.
Electronics Forum | Tue Jun 06 17:00:36 EDT 2006 | pjc
Be carefull of the effect on other components with a 7mil stencil, like fine-pitch devices will bridge more, excess solder.
Electronics Forum | Wed Jun 07 09:26:09 EDT 2006 | amol_kane
can you also please tell us the section in IPC-610?...is this in RevD? also, does this also give the solder volume for BGAs? Thanks, Amol
Electronics Forum | Mon Jun 12 22:11:11 EDT 2006 | danielchankh
Is there anyone out there who has used fringe pattern image projection vs laser triangulation method for solder paste volume inspection? Need some advice on which is better?
