Electronics Forum: solder and bump and reflow and process (Page 2 of 10)

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 16 16:35:55 EST 2002 | Jim Ferris

Randy, Steve & all, Can you guys point me in the right direction when it come to using selective wave soldering...I am trying to get in-depth information on the Pro's & Con's of having our supplier use this process for our PWA's. (I can see there ar

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

Touch-up and Inspection Process

Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj

The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i

LGA and Solderballs

Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef

J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause

AXI and AOI

Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc

When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A

When? How and What??

Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English

Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper

Headers and SMT

Electronics Forum | Tue Sep 29 11:49:02 EDT 2015 | spoiltforchoice

Typically - hand soldering as you are currently doing. Should your volume justify it you can invest in a selective soldering solution, these might take the form of a robotic arm that essentially replicates manual soldering or a solder jet similar to

Flux Designations and Composition

Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef

You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

Pick and Place Rivet

Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost

that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that


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