Electronics Forum | Tue Aug 09 10:38:45 EDT 2005 | SuMoTe
Water soluable dots will wash off after reflow. A water soluable liquid mask will work as well. dots are better for defined (round)holes, whereas the liquid mask works well with odd shapes.
Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc
When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A
Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener
I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl
Electronics Forum | Wed Aug 21 10:26:08 EDT 2002 | stownsend
We are using OSP coated boards and no-clean solder paste. In a few instances, we are seeing increased distortion in an audio circuit. Has anybody seen or heard of surface insulation resistance (SIR) decreasing after reflow on OSP boards? Is it possib
Electronics Forum | Wed Nov 06 05:13:01 EST 2002 | Dreamsniper
Crystalline flux if it is really clear should not be a problem. We were using Amtech paste before and we have the same results. Sometimes we mistakenly see it as a dry joint because of the reflections from the lighting of our Metcal inspection system
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
