Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG
Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?
Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH
1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Tue Feb 20 18:04:53 EST 2007 | coop
I am not familiar with the YV100XG pick & place but you might want to increase the mount height of these components The double stick tape isn't as thick solder paste. it might be pushing the component too far down causing it to twist. I encountered
Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
