Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr
| Hi there Gary, | Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly
Electronics Forum | Fri Apr 06 12:31:07 EDT 2018 | deanm
Your fluxes are required to be compatible per J-STD-001. I wouldn't even attempt mixing no-clean (rosin) and clean (assuming water soluble) fluxes on the same assembly, especially if the fluxes are from two different vendors. If your paste and liquid
Electronics Forum | Tue Sep 30 14:24:37 EDT 2008 | eedlund
A water soluble solder paste (AIM WS483), reflow and wash. We are considering using AIM NC254 No-clean solder paste to eliminate the wash step.
