Electronics Forum | Wed Feb 08 03:24:00 EST 2017 | soldertraining
Tin dipping of components in RoHS compatible solder is one means to turn the lead bearing components in to devices which can be used in a RoHS compatible soldering process. The conversion of lead bearing components into those which can be used in the
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Tue Dec 26 11:09:16 EST 2000 | acahill
High temp paste or not, I feel it's all up to the oven,and/or the stencil design. are there sufficient solder joints, before running the opposite side (are the apertures large enough to achieve a hardy fillet or to small, allowing enough paste to vis
Electronics Forum | Wed Apr 23 07:27:21 EDT 2008 | realchunks
Floor life of a PCB is rated in years. Are you asking about the solder paste or something else?
Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau
RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have
Electronics Forum | Tue Nov 05 00:51:39 EST 2002 | yngwie
How to measure the max allowable force when we press the heatsink at the attachment process. I was posted with question by my customer, " how to I ensure that the force I use to attach the heatsink does not causing any damage to the solder joint on t
Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef
The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking
Electronics Forum | Fri Dec 22 12:17:02 EST 2000 | vickij
Hi! Has anyone out there ever tried to use a high-temp and a low-temp solder paste on a double-sided board without using an adhesive? (Populate the bottom side with the high temp paste, reflow, turn it over, then run the top side). I looked in the
Electronics Forum | Wed Jan 10 04:33:05 EST 2018 | spoiltforchoice
Simulating with what? In developed countries manual labour is expensive but is also still the most common solution to fitting though hole parts, even if the board are then wave-soldered. Mixing SMT and THT on what sounds like a very simple product wi
Electronics Forum | Wed May 22 16:36:13 EDT 2002 | slthomas
What methods do you guys use for maintaining lot and/or board traceability? When I worked in med. products, we used travelers that we recorded everything on, then serialized them at the end of the build. Not as effective as up front serialization,
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