Electronics Forum | Tue Dec 31 01:30:07 EST 2019 | sssamw
Do you have clear pictures show IC soldering and the solder ball? DO you have clear picture show the PCB pad?
Electronics Forum | Tue Dec 31 09:24:22 EST 2019 | SMTA-Davandran
You may try reduction on stencil aperture on the particular IC location. Reduction on width and extend outer length may help to minimise solder ball issue. However, please look into stencil foil thickness to meet AR.
Electronics Forum | Fri Jan 03 11:37:24 EST 2020 | emeto
Sometimes might be internal change with personnel. Issue is actually there, but if no one questions it-it is not an issue. With 7mil stencil there is a good chance to have solder balls. So were they registered or were they fixed/cleaned?
Electronics Forum | Sat Feb 06 07:14:40 EST 2021 | agoesfirmanto
Dear Sirs, very sorry being late reply after a year. Thank you very much for your advices, you are absolutely correct after reduce grounding pad size. No more solder ball issue. Thank you very much. highly appreciate all of your supports. Best re
Electronics Forum | Sat Feb 06 07:17:47 EST 2021 | agoesfirmanto
Hello Pak Zack. very sorry late reply Thank you for your sharing. Solder ball issue already solved. Best regards, Agoes
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Tue Jun 04 10:39:45 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 16:48:05 EDT 2002 | russ
Where are they at, and what size?
Electronics Forum | Tue Dec 31 01:35:44 EST 2019 | agoesfirmanto
Dear Sir, Thank you for your response. I show you the picture
