Electronics Forum: solder ball ipc-a-610e (Page 2 of 216)

solder ball

Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto

Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.

solder ball

Electronics Forum | Tue Jun 04 10:39:45 EDT 2002 | jasonfang

Does anyone knows root cause of solderball after reflow? Thanks

solder ball

Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang

Does anyone knows root cause of solderball after reflow? Thanks

solder ball

Electronics Forum | Tue Jun 04 16:48:05 EDT 2002 | russ

Where are they at, and what size?

solder ball

Electronics Forum | Tue Dec 31 01:35:44 EST 2019 | agoesfirmanto

Dear Sir, Thank you for your response. I show you the picture

solder ball

Electronics Forum | Thu Jun 10 19:20:59 EDT 2021 | kojotssss

Hi, Too much paste on grounding pad. Looks like also doesnt have path for gases, for void escaping.

solder ball

Electronics Forum | Thu Jan 02 22:23:54 EST 2020 | jakapratama

Hello Pak Agus, Was there perhaps a change in solder paste? There has been confirmed occurrence in your case which happened in the work place I was before; all same parameter, equipment, material, and suddenly solder ball outbreak happened across al

solder ball

Electronics Forum | Tue Dec 31 02:13:14 EST 2019 | agoesfirmanto

This PCB model has been in production since 2018 and stopped production almost 1 year ago, now it has started production again and I found this problem. at the time of production in 2018 this problem did not occur. while the parameter settings do not

solder ball

Electronics Forum | Thu Jan 02 07:04:57 EST 2020 | dontfeedphils

Pretty large solder-ball. Looks like it may have come from the ground pad since it's so large, in which case I would reduce the print coverage on the middle/ground pad and see how it works for you. You verified that these parts have the groundpad a

solder ball

Electronics Forum | Thu Jun 06 09:28:24 EDT 2002 | Hussman69

Sure do, it's from the paste that gets squeezed under your R's and C's. This paste is now on your mask and during reflow, wants to move off the mask. Unfortunatly, it follows the flux residue to the side of your component. An easy fix is to use th


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