Electronics Forum | Wed Jul 18 02:09:50 EDT 2001 | winnifred
Steven, You CANNOT just use water to clean away the solder ball when u hv used RMA paste.
Electronics Forum | Thu May 06 10:05:58 EDT 2004 | leon
iam having trouble with solder balls around 1206 caps and resistors, have used different pastes changed oven profiles can any advise something else
Electronics Forum | Sun May 09 12:59:29 EDT 2004 | Lloydy
Try using the wendy-house style on the specififc area's where you have solder balling. It's not always a good idea to do a global reduction to all apperatures.
Electronics Forum | Tue May 11 22:20:42 EDT 2004 | davef
Solder ball problems has to be one of the most popular topics on SMTnet. There is hundreds of postings on the topic in the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=15669
Electronics Forum | Thu Feb 08 12:02:15 EST 2001 | slthomas
After reading the variety of responses, I feel moved to ask if you're you talking about what are occasionally referred to as solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) or the solder balls that ten
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Thu Feb 08 12:16:05 EST 2001 | Antonio
I wasn't specific which type. But all this info helps. Thanks a bunch fellas...
Electronics Forum | Mon May 10 18:43:23 EDT 2004 | steve davis
Just curious what stencil company are you currently using? What style of aperture are you using for the componet?
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
