Electronics Forum: solder failure (Page 2 of 66)

Component failure analysis

Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee

What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold

SMT LED functional failure

Electronics Forum | Thu Apr 17 10:25:42 EDT 2003 | davef

You'd think 219*C should be warm enough, but we'd go higher just to get the part to stick. What is: * LED terminations material? * Alloy and flux type of your solder paste? Is you solder sticking to the pad and not to the component? Or what?

BGA failure after coating

Electronics Forum | Mon Oct 05 04:55:42 EDT 2009 | pengliang

we suggest as below : the first : check the soldering(solder ball and pad) by X-ray ; second: to do dye analyse (note:pls confrm is there have crack )

SMT LED functional failure

Electronics Forum | Wed Apr 16 01:40:17 EDT 2003 | praveen

Hi , We are using water wash solder paste to solder the SMT LED's manufactured by Chicago Miniature lamp (CMD93-21 & 22)and Kingbright. Achieving the solder fillet , wetting has no issue but we observe high fallout at the functional testing. If we do

SMT LED functional failure

Electronics Forum | Wed Apr 16 08:43:00 EDT 2003 | davef

Given that the LED work properly after being touched-up and that you don't have problems with other components, you may not be wetting the LED termination solderability protection during your normal reflow. Use a profiler to check the temperature on

BGA failure after coating

Electronics Forum | Wed Sep 30 11:32:45 EDT 2009 | pbarton

What type of conformal coating are you using and are you allowing the coating to migrate under the device in question? If you are allowing the coating unbder the BGA the problem could be CTE of coating is much greater than that of the BGA balls/sold

BGA failure after coating

Electronics Forum | Thu Oct 08 08:15:39 EDT 2009 | kpm135

We've used both 1A33 urethane and 1B31 acrylic coating on our SMT assemblies with great success for many many years. This is with components of all shapes and sizes including a 9 ball micro-BGA. We apply the coating in every way imaginable and we hav

Soldering failure in time (FIT)

Electronics Forum | Tue Dec 14 20:31:53 EST 2004 | davef

The FIT we mentioned is for a stocked, finished good item. It's for something shipped to a customer.

Soldering failure in time (FIT)

Electronics Forum | Tue Dec 14 10:58:56 EST 2004 | Peppe

Thanks for your answer Dave. Just a clarification. Given FIT is for just one soldering or for a specific number ? I mean cards we produce have, typically, 10000 soldering joints. Which is the expected FIT of that card ? Thanks again for your help.

Soldering failure in time (FIT)

Electronics Forum | Tue Dec 14 08:32:10 EST 2004 | davef

Depending on the design, materials selection, end use, etc; we'd expect the FIT of an electronic assembly to be between 30 and 100+. There is no standard.


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