Electronics Forum: solder fines in no clean (Page 2 of 2)

Solder particals in the oven?

Electronics Forum | Tue Jun 04 17:05:52 EDT 2002 | davef

Solder balls floating around on the air currents of a reflow oven. I sincerely doubt it. Could the solder on your gold fingers be from: * Excess placement force during P&P? * Ejactula from solder deposits during rapid preheat ramp rates? * Ejactula

Component missing in siplace mounter

Electronics Forum | Tue May 07 13:49:05 EDT 2019 | tey422

Like I stated before, I am not familiar with the machine. I can only make suggestions. If you found solder paste on the nozzle, clean it off to prevent part stuck to the nozzle tip. I would also check if the nozzle tips are being worn off; uneven we

Excess Flux in uBGA rework

Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman

If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle

Nitrogen use in reflow and wave

Electronics Forum | Sat Apr 20 10:12:16 EDT 2002 | davef

If people use an inert gas, they use nitrogen for mass soldering. Inert gases get progressively more expensive as you move down the periodic table. Many times no-clean flux is less active than other flux types. So, people use an inert gas to lower

Freshman in SMT industry needing advice

Electronics Forum | Wed Sep 22 14:45:01 EDT 2004 | Michelle Ogihara

As many people have participated in this email string, including competitors and customers of Sawa, I would like to respond to especially one rather detailed email expressing concerns with this stencil cleaning system. Also, this teaches me to keep

Freshman in SMT industry needing advice

Electronics Forum | Tue Mar 09 14:22:09 EST 2004 | billschreiber

There is an article on our web site by Richard Clouthier, �SMT Stencil Cleaning: A Decision That Could Impact Production.� He talks about how high pressure sprays can damage the delicate land mass areas between fine-pitch apertures. High pressure ai

Freshman in SMT industry needing advice

Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn

It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Tue Jan 15 15:42:15 EST 2008 | ck_the_flip

Patrick, you're right. I've only dealt with 2 different flavors of Alpha alcohol-based flux. I've always thought that the convection causes the activator to evaporate more rapidly, but this is probably just the case with older formulations. Again,

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf

I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS

How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor

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