Industry News | 2011-08-22 18:45:28.0
MIRTEC, “The Global Leader in Inspection Technology” will premier its complete line of AOI systems in booth #100 at IPC Midwest 2011
Industry News | 2011-09-19 16:37:06.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it will premier its complete line of AOI systems in Booth #124 at SMTA International 2011.
Industry News | 2011-03-11 18:06:16.0
MIRTEC will feature an MV-7xi configured with the exclusive 15 Mega Pixel ISIS Vision System and proprietary 3D AOI technology in booth #1925 at the upcoming IPC APEX EXPO.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
New Equipment | Assembly Services
Detailed introduction of 3D spi-7500 solder paste thickness gauge Product function Fast programming, friendly programming interface 1. Multiple measurement methods 2. True one button measurement 3. Eight square movement button, one key foc
Industry News | 2023-07-22 11:28:46.0
If need more technical support , pls contact with us at Jenny@ksunsmt.com
Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
New Equipment | Assembly Services
Specification Model Item High -Speed Compact Modular Mounter RX-7R (P16SxP16S head) (P16Sxp8 head) (P8xP8 head) Board size Single lane conveyer