Electronics Forum | Tue Nov 28 21:03:48 EST 2000 | Dave F
Getting people to stop sounds like a good idea, but once they get running after a lengthy set-up, you can sort of understand why they don't want to stop when they quickly run out of paste after emptying a partially filled tube. Beyond the paste qual
Electronics Forum | Wed Dec 20 09:41:52 EST 2000 | blnorman
Ideally we want to mix the same lot numbers in a repackaged tube. Once again, these are partial tubes that have been thrown away. If the ratio is right to begin with the only change would be due to air exposure. Semco makes a TC seal which, if we
Electronics Forum | Fri Dec 01 12:02:15 EST 2000 | blnorman
I have over 10 years experience in aerospace materials, part of which was involved with vacuum casting inert propellant formulations. These propellants are in the range of 80 - 90% solids loaded with viscosities of 15 kP. I'm not sure where I could
Electronics Forum | Mon Nov 15 15:27:48 EST 2004 | davef
In creating your solder balls, consider printing or dispensing solder paste on the pads of the LGA and then reflowing the paste.
Electronics Forum | Thu Nov 20 14:49:54 EST 2014 | joe98375
Greetings, I am looking into buying a wave solder machine for medium production of 100% through hole boards (~8.5"X12" dimension, not many layers, no high density part areas,
Electronics Forum | Mon Nov 15 14:26:11 EST 2004 | nrocco
also the balls need to be lead free, just to make it more interesting.
Electronics Forum | Thu Nov 20 17:56:39 EST 2014 | warwolf
can you link to the one you are looking at getting?
Electronics Forum | Thu Nov 18 09:25:42 EST 2004 | pjc
Vanguard is a ball placement machine. They are out on Long Island NY and manufactured by White Eagle Engineering. The contact person is Pete Heinzl 520-791-0239, pheinzl@whiteeagleeng.com
Electronics Forum | Thu Nov 20 17:58:55 EST 2014 | joe98375
here it is: http://www.pcbunlimited.com/ben-z-400-f-lead-free-wave-solder-p-556.html
Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching