Full Site - : solder sulfur (Page 2 of 3)

Raw PCB packaging

Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef

Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E

PCB immersion silver discolouration

Electronics Forum | Sun Sep 21 10:55:52 EDT 2008 | vladig

As long as the surface is solderable, you should be fine. Silver tarnish a well0-known thing. Make sure, though, there is no sulfur (S) "around". Regards, Vlad

External Factors to be controlled during assembly

Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef

All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d

HELP! Plating issue on chassis

Electronics Forum | Fri May 21 12:24:21 EDT 1999 | KA Stillings

I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!!!

Re: Sodium Chloride (NaCl)

Electronics Forum | Mon Mar 01 22:24:53 EST 1999 | Dave F

| It seems to be that we have to much NaCl left on our assambled PCB's. | The flux we use is from cobar. They say it can not be from the flux... So what can be the reason, what kind of problem may occer when there is to much NaCl. | George: When so

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Wed May 27 21:05:30 EDT 1998 | Steve Gregory

Hey yooze guys! Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any posts f

Immersion Ag

Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef

We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition

Immersion Silver

Electronics Forum | Fri Jan 11 17:14:13 EST 2002 | davef

We have one product with electroless nickel, immersion silver solderability protection. We do not purport to be experts, but like many things, have seemingly boundless opinions. Side note: There are a least three different [maybe five] imm silver

Re: HELP! Plating issue on chassis

Electronics Forum | Fri May 21 15:20:26 EDT 1999 | JohnW

| I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Thu May 28 07:25:58 EDT 1998 | Earl Moon

| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p


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