Electronics Forum | Thu Sep 13 21:56:09 EDT 2007 | wayne_
should have ask the technical support personnel from Kester to come over to your factory and solve the problem on-site. Let them see what is wrong with their product, then they will improve it further....or straight away tell you they do not have sol
Electronics Forum | Sat Sep 15 13:00:44 EDT 2007 | slthomas
220 should be plenty although if they're lead free you might need a little more heat. Is it possible that you've got a paste volume issue (stencil design, clogged apertures), or maybe the footprint isn't right for the part? I had this same problem
Electronics Forum | Fri Sep 14 09:34:17 EDT 2007 | russ
you using a ramp soak spike or ramp to spike profile? you may be burning out your flux in preheat if you ramp to fast or for too long, most pastes have 2 activation points for their flux one at low temp and one at higher temp. Try a ramp to peak pr
Electronics Forum | Fri Aug 08 09:49:17 EDT 2008 | scottp
We've seen the exact same problem. The solder joints had negative wetting angles and x-sections show that the PdAg termination dissolved into the solder. We no longer allow PdAg terminations.
Electronics Forum | Fri Dec 16 13:31:03 EST 2005 | gpaelmo
Thanks for your response.
Electronics Forum | Fri Dec 16 13:31:28 EST 2005 | gpaelmo
Thanks for your response.
Electronics Forum | Sun Aug 10 03:41:20 EDT 2008 | eyalg
Thanks for your promt reply It was very usefull Eyal
Electronics Forum | Sun Aug 10 03:39:21 EDT 2008 | eyalg
Thanks Pete yes we usu ROHS solder paste in our process. I agree that this termination is more suitable for adhsive bonding rather than soldering. We'll try changing the termination type as you recommended. Eyal G
Electronics Forum | Thu Aug 07 11:58:36 EDT 2008 | pbarton
We have experienced the same problem with Pd/AG and P/Ag terminations on precision resistive parts. The problem is dissolution of the termination metallisation into the bulk solder. This is exacerbated by the higher thermal profiles required for RoHS
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've