Electronics Forum | Tue Jul 18 03:04:46 EDT 2006 | sharifudin
We are trying to reduce the number of unit fail at QA Visual Inspection due to Solder On Gold Finger. We know so far that the solder is spattering onto the Gold Finger during reflow. I need some advise on what kind of process can improve to reduce th
Electronics Forum | Mon Jul 16 16:42:40 EDT 2007 | pnguyvu
Hi Jacky, It seems you have solder bead problem, beading occurs when the solder paste brick splatter as a component is placed into it, after reflow, the splatter becomes a spherical solder ball. Hope this will help. Steve USA STENCILS
Electronics Forum | Fri Jul 20 16:39:18 EDT 2007 | john_smith
Jacky, we have had a similar problem. We needed to go to a smaller nozzle and also check your vacuume system and air kiss.Could be after placement when the machine blows air to insure the part is off the nozzle that it is effecting the solder brick.
Electronics Forum | Mon Nov 19 14:10:13 EST 2007 | realchunks
Hi Taint, Both machines work OK. The big thing you may over look is pre-heat. Things like flux spatter/boil tend to come into play if you don't pre-heat. Change over, ease of programming, and service are also things to think of.
Electronics Forum | Mon Aug 11 10:48:06 EDT 2008 | realchunks
Too much flux will spatter and can leave balls on either side. From your pix you may too little flux. Try turning up and see. Also try hand applying your alcohol based flux and running through. Will take away a few question marks.
Electronics Forum | Thu Oct 16 12:12:16 EDT 2008 | slthomas
"We don't associate solder balls with no-clean flux and humidity." I'll let the former speak for itself, but on the latter, not even spatters?
Electronics Forum | Sun May 16 03:38:49 EDT 1999 | Zambri
I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. I don't fa
Electronics Forum | Wed May 19 11:07:25 EDT 1999 | Glenn Robertson
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu Jun 06 11:42:24 EDT 2002 | Brad Jakeway
What you are seeing on your gold fingers is referred to as flux spattering. This is a very commond problem with gold fingers if you have a zero flux spattering criteria for quality control. The key to eliminating this problem is in the reflow profi
Electronics Forum | Thu Feb 08 12:02:15 EST 2001 | slthomas
After reading the variety of responses, I feel moved to ask if you're you talking about what are occasionally referred to as solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) or the solder balls that ten
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