Electronics Forum | Thu Apr 28 01:30:54 EDT 2022 | sophyluo1985
Achieving high reliability and high efficiency in SMT process (Surface Mount Technology) assembly has always been the goal of electronics manufacturers expecting consistency. It depends on the optimization of every detail of the whole process. For SM
Electronics Forum | Mon Mar 02 08:25:08 EST 2009 | jorge_quijano
Thanx for all your recomendations, we already ask for a 3D SPI and help us well, we are asking for a ultrasonic stencil cleaner. By the way how do you deal with the 'head in pillow' defects? is there a solder paste alloy / profile issue?
Electronics Forum | Thu May 13 11:25:02 EDT 2021 | rsikora
Thanks for the replies. MCS is not on our 3030, it probably wasn't available on the 3030 model. The ethernet switch which connects the vision pc and the rtpc was found to be defective. The switch was replaced and the 3030 returned to normal operat
Electronics Forum | Fri Sep 10 15:15:09 EDT 2021 | majdi4
Hello to all , Could you help with this defect .. Tombstoning 0201 , always at the same place in board , only this component near to the coax connector..with a defect rate of 2 % ..All the process is perfect . i cheked : stencil design , SPI resul
Electronics Forum | Tue Aug 06 16:49:57 EDT 2019 | jmedernach
HI, The short answer is, "whichever machine finds your defects." I would suggest evaluating machines based on a common vehicle. Make a bad board and identify the defects. Make a good board and have your vendor teach and tune the machine to the goo
Electronics Forum | Mon Feb 10 16:59:57 EST 2014 | hegemon
It is sort of a self answering question if you come in from the solder paste angle. First....start gathering data. Check every day, or every new paste jar, for: Storage conditions (temp), paste expiration date, ambient temp and humidity where yo
Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef
There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g
Electronics Forum | Mon Oct 03 07:38:36 EDT 2016 | cyber_wolf
We successfully re-print mis-prints all of the time. We have SPI machines at every printer that let us know if it is OK or not. Sometimes dealing with the solder defect is better than cleaning the mis-print. It is very difficult not to wedge solder
Electronics Forum | Tue Jan 24 12:39:24 EST 2023 | linux
Hello MagyarT, Software that Combines data from Kohyoung AOI,SPI and panasonic assembly machines YJLINK conveyors to track back quality root causes of defects -See real-time OEE on your panasonic lines at each location -Drill-down on SMT bottlenecks
Electronics Forum | Tue Jun 05 02:10:01 EDT 2018 | buckcho
Hello sir, Limits in SPI can vary a lot, also depending on finishing of the pcb. For example 170% volume on an IC (assuming is fine pitch) can be okay for ENIG, but very bad if HASL. For are I would recommend that you use either 50-130, or 60-135 max
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