Electronics Forum | Mon Jun 13 14:34:16 EDT 2005 | peter ng
The stencil thickness should be 5.5 mils.The squeeze speed around 20mm/s,print gap 0.15mm,print separation 0.3mm/s.
Electronics Forum | Thu Mar 02 12:09:12 EST 2006 | jrr3434
I have a board with 0603 parts with .2mm spacing between the parts and in some areas smaller. Can any one help me on what size stencil thickness I need. Any help would be appreciated. Jay
Electronics Forum | Thu Jun 09 21:31:55 EDT 2005 | KEN
I don't think durastone is ESD safe.
Electronics Forum | Thu Mar 02 17:46:22 EST 2006 | Chris
Go with no greater than 0.005". Pleanty of paste and minimal shorting issues. 0.004" will even work
Electronics Forum | Thu Mar 02 18:15:23 EST 2006 | Dirka Jihabi
I disagree with the homeplate approach.
Electronics Forum | Thu Mar 02 22:19:00 EST 2006 | E. Moon
Are you guys really hiring? I like your thinking!
Electronics Forum | Fri Mar 03 08:25:29 EST 2006 | azbvc
MELF shape works perfect for me.
Electronics Forum | Thu Jun 09 07:02:02 EDT 2005 | ajaydoshi
1. We do have PCB with 0402 component, Micro BGA ( 0.5mm pitch , 0.25 mm pad size ). PCB thickness is 0.8mm. What stencil thickness we should use. PCB size 40 mm X 60 mm 2. We have EKRA E4 , What will be optimum setting for above. Pressure, Scquge s
Electronics Forum | Thu Mar 02 13:29:30 EST 2006 | russ
6 mils maybe? instead of 6mm? We go down to 5 mils and up to 7 with 0603. You could even use a 4mil stencil for these without any problems. The .2mm (.0078")apart however might get you in trouble unless your equipment is rock solid.
Electronics Forum | Thu Jun 09 07:36:49 EDT 2005 | ajaydoshi
Thanks, 1. Any idea how to go about pallet. because this PCB is single only ( not in multiple ). if you have some drawing / picture pl. send me at ajay_doshi@utlindia.com 2. What are other parameter to set on machine ajay
