Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Mon Apr 24 09:43:47 EDT 2006 | printerman
What you describe is the X snuggers fitted into the workholder which do need either a flat board or good vacuum to work. There are several solutions. One solution you can try yourself is to use Vacuum cups, ( bellows type) designed into the workholde
Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef
I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA
Electronics Forum | Thu Apr 21 20:09:18 EDT 2016 | adamjs
I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. You do need the thicker stencil. To prevent the shorts, you need to have your pick-and-place machine probe the exact height of the board (at multiple loca
Electronics Forum | Mon Nov 29 13:09:12 EST 1999 | Mike Konrad
There are three primary methods of stencil cleaning. � Hand Cleaning � Spray-In-Air Cleaning � Ultrasonic Cleaning Hand Cleaning: Hand cleaning involves the removal of solder paste or adhesives from stencils using a chemically saturated wipe and /
Electronics Forum | Fri Oct 25 12:23:49 EDT 2002 | yngwie
Hi Experts, I'm facing short problem with BGA at SRT rework in one particular BGA. It is BGA, with a metal piece at the center like a coin. The BGA is located in between two high profile press fit connectors and the short always observed at the si
Electronics Forum | Wed Jan 29 10:40:37 EST 2020 | tamasmagyar
Hi there, I used Grid-Lok and some other PCB support from Quik-Tool (don't ask me model :) ), which is pretty similar to Grid-Lok, in Viscom machines. We also had jigs for high volume products similar to those you would use for PCB routing, but with
Electronics Forum | Tue Mar 13 17:26:07 EST 2001 | blair
1) We could press on BGAs and the boards would boot 2) This is basic boot up yield 3) We are now getting stpe by step inspection data going fwd. 4) So, Stencil design could be a critical factor. Any documented guidelines? 5) Yes DFX was done - mostl
Electronics Forum | Fri Jun 29 10:56:56 EDT 2012 | jorge_quijano
Hi guys, I need your advise on this, I have a very uncommon PCB design (at least for me, I've never seen anything like this...) it is 32" x 18" x 0.062" and has 9 QFNs that are driving me crazy, I'm not able to get a good alignment, I can get a mediu
Electronics Forum | Mon Aug 12 12:05:35 EDT 2002 | russ
I use Paste for high temp balls and/or co-planarity/warpage issues. normally I only use paste flux for ball attachment. One down side to paste application is registration and volume anomalies with those little micro-stencils (for me anyway). Your
