Electronics Forum | Wed Aug 22 21:11:25 EDT 2001 | davef
When it works right, it's a beautious thing. => When goes wrong, you have one board with some of the other board's material, not too coo. Scribed and broken ceramic has bad-butt sharp edges. You'll feel this sticky stuff on your hands, look down,
Electronics Forum | Thu May 09 17:21:39 EDT 2002 | davef
In describing a bare board, you need to talk about base, laminate, and conductive materials. Common laminate materials are: * Glass fabric * Cotton fabric * Paper Common NEMA grades of technical laminates are: * Glass Fabric Grades: G3, G7, G10,
Electronics Forum | Wed Jan 30 17:44:38 EST 2002 | davef
The gold is compatible with your solder. Gold will dissolve in your solder very quickly. Assuming you have a fairly large [~ couple hundred pounds] solder pot, the gold will not, over the short term, affect the performance of the pot. The issue is
Electronics Forum | Thu Sep 24 06:30:28 EDT 2009 | cathtee
Is there any vision system to check for substrate crack?
Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef
What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
Electronics Forum | Wed Jun 25 03:49:17 EDT 2003 | M.DAttilio
Hello everyone, my company produce Alumina PCB. Till now we mount ceramic BGA on alumina substrate, but now it's hard to find ceramic components so we'd like to mount plastic BGA on this kind of substrate. Do you know problems about it? Please, if yo
Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood
We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu
Electronics Forum | Thu Dec 10 03:37:29 EST 1998 | Youngho Song
Hi everybody? I heard that typical FR-4 would not acceptable for BGA application. What is the main reason? (thermal property? or CTE?) Sombody please answer me the requirement of PCB substrate for PCB application. Thanks. Youngho Song
Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon
| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son
