Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2011-05-16 15:56:59.0
JBC Tools announces that it will exhibit at the upcoming SMTA Oregon Symposium and Supplier Day, scheduled to take place Wednesday, May 18, 2011 at the Tektronix Building 38 Conference Center in Beaverton, OR.
Industry News | 2011-05-16 16:26:21.0
Aqueous Technologies will highlight the new Trident aSPC Software at the upcoming SMTA Oregon Symposium and Supplier Day, scheduled to take place Wednesday, May 18, 2011 at the Tektronix Building 38 Conference Center in Beaverton, OR.
Industry News | 2008-09-19 15:44:58.0
Test Equipment Connection Corporation today announced the company has been chosen to sell new Scientific Test discrete semiconductor test equipment.
Industry News | 2013-02-11 12:25:08.0
Recon Test Equipment, Inc. located in Longwood Florida is now bilingual with English and Spanish speaking sales representatives.
Industry News | 2004-02-03 04:25:42.0
Performance improvements position Valor to execute on major expansion plans.
Industry News | 2012-08-01 16:27:28.0
LPKF Laser & Electronics will present a live webinar on September 4, 2012 at 11 a.m. PDT. How Stencil Manufacturing Methods Impact Precision and Accuracy will be hosted by Shane Stafford, LPKF market development representative, and presented by Ahne Oosterhof, stencil manufacturing industry expert and founder of A-Laser.
Industry News | 2007-08-02 17:44:00.0
ePSeries Printers at SMTAI Booth#329 and Nepcon East# 723
Industry News | 2008-08-21 13:06:34.0
New RIGOL Digital Storage Oscilloscopes and Mixed Signal Oscilloscopes to be Distributed by Test Equipment Connection
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