Electronics Forum | Tue May 01 20:36:03 EDT 2001 | davef
Sorry to disappoint, bud. Believe it or not, this guy's for real. It'll be sad when his investors find out that returns on contacting are something akin to pass book accounts. I'd do something like the prank that you imply, but this is a lame topi
Electronics Forum | Tue May 01 23:06:07 EDT 2001 | djarvis
Mate, I'd love to but we are not allowed to use ENIG (Empaestic Noumenal Ideopraxistical Gunk) here so I really couldn't enter into the debate. Surely people realise that your average SMT boffin is a mental case in a blue coat. I looked up "SMT-engin
Electronics Forum | Thu May 31 10:19:04 EDT 2001 | genny
Good news! I put in a request to purchase the spec and it was approved! And then I found out that we recently renewed our IPC membership (I didn't know we ever had one) so we don't even need to pay the nonmember price! Good reading ahead...
Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef
See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6
Electronics Forum | Mon May 14 09:39:55 EDT 2001 | martys
What role will AOI play in the future in PCB Assembly?
Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Sat Jul 14 08:56:39 EDT 2001 | davef
Cal is right on target. I'll expand on his points. BGA solder perform suppliers: * Winslow Automation: http://www.winslowautomation.com/ * Galahad 12784 Tulipwood Circle Boca Raton, FL 33428 561-487-0271 galahad.inc@usa.netemail: BGAKIT@concentric
Electronics Forum | Sun Jul 15 12:34:15 EDT 2001 | clktsh88
There is a equipment brand : Martin is capable to do you want. In US you may try to approach Manncorp for it. Bye
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